| Panga | vitu | Uwezo wa kawaida | Uwezo maalum |
| hesabu ya safu | PCB isiyobadilika-badilika | 2-14 | 2-24 |
| Flex PCB | 1-10 | 1-12 | |
| bodi | 0.08 +/- 0.03mm | 0.05 +/- 0.03mm | |
| Dak.Unene | |||
| Max.Unene | 6 mm | 8 mm | |
| Max.Ukubwa | 485mm * 1000mm | 485mm * 1500mm | |
| Shimo & Slot | Hole | 0.15 mm | 0.05mm |
| Min.Slot Hole | 0.6 mm | 0.5mm | |
| Uwiano wa kipengele | 10:01 | 12:01 | |
| Fuatilia | Min.Upana / Nafasi | 0.05 / 0.05mm | 0.025 / 0.025mm |
| Uvumilivu | Fuatilia W / S | ± 0.03mm | ± 0.02mm |
| (W/S≥0.3mm:±10%) | (W/S≥0.2mm:±10%) | ||
| Shimo kwa shimo | ± 0.075mm | ± 0.05mm | |
| Dimension ya shimo | ± 0.075mm | ± 0.05mm | |
| Impedans | 0 ≤ Thamani ≤ 50Ω : ± 5Ω 50Ω ≤ Thamani : ± 10%Ω | ||
| Nyenzo | Uainishaji wa Basefilm | PI : 3mil 2mil 1mil 0.8mil 0.5mil | |
| ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
| Basefilm Muuzaji mkuu | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
| Uainishaji wa Kufunika | PI : 2mil 1mil 0.5mil | ||
| Rangi ya LPI | Kijani / Njano / Nyeupe / Nyeusi / Bluu / Nyekundu | ||
| PI Stiffener | T : 25um ~250um | ||
| FR4 Kigumu | T : 100um ~ 2000um | ||
| SUS Stiffener | T : 100um ~400um | ||
| AL Stiffener | T : 100um ~ 1600um | ||
| Mkanda | 3M / Tesa / Nitto | ||
| Kinga ya EMI | Filamu ya fedha / Wino wa Shaba / Fedha | ||
| Kumaliza uso | OSP | 0.1 - 0.3um | |
| HASL | Sn : 5um - 40um | ||
| HASL (Leed bila malipo) | Sn : 5um - 40um | ||
| ENEPIG | Ni : 1.0 - 6.0um | ||
| Ba : 0.015-0.10um | |||
| Au : 0.015 - 0.10um | |||
| Kuweka dhahabu ngumu | Ni : 1.0 - 6.0um | ||
| Au : 0.02um - 1um | |||
| Kiwango cha dhahabu | Ni : 1.0 - 6.0um | ||
| Au : 0.02um - 0.1um | |||
| ENIG | Ni : 1.0 - 6.0um | ||
| Au : 0.015um - 0.10um | |||
| Kuweka fedha | Ag: 0.1 - 0.3um | ||
| Kuweka bati | Sn : 5um - 35um | ||
| SMT | Aina | Viunganishi vya lami 0.3mm | |
| 0.4mm lami BGA / QFP / QFN | |||
| Sehemu ya 0201 |